MST presents:
System in Package Solutions on Organic and Ceramic Substrates made in Europe
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System in Package Solutions on Organic and Ceramic Substrates made in Europe

Abstract
In today's rapidly evolving technology landscape, packing more functionality into smaller spaces is a universal challenge. Focusing on the critical areas of semiconductor packaging and electronic manufacturing services (EMS), this webinar will provide invaluable insights for both technical experts and business leaders.

Join us as we unravel the concept of System in Package (SiP) and discover how it integrates multiple assembly technologies into a single package. Dive deep into the intricate production workflow of SiP assemblies, from wafer preparation and substrates to bonding techniques, encapsulation technologies, interconnect methodologies, and comprehensive test protocols.

You will also gain a strategic perspective as we explore the markets and applications in which MSE focuses its expertise. Discover the collaboration opportunities that await your organization as we present MSE as a leading European supplier ready to partner with you to realize your technology ambitions.
Experts:
Maximilian Wallrodt
Technical Marketing Manager


Heinie von Michaelis
Sales Manager & Consultant
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Duration:
25 minutes