Packaging Substrates in the European Supply Chain
Abstract
The worldwide supply of packaging substrates for Silicon chips is dominated by a few large fabricators. Most of them are located in Asia and currently allocating most of their production capacity to high-volume customers in the computer, mobile phone, and automotive industries. OEMs with smaller order volumes are facing lead-times of 12 months and more. In this webinar, Dr. Stephan Trautweiler and Julia Wülser will explain how Dyconex is supplying packaging substrates for small to medium volumes and contributing to paving the way to a European supply chain for microelectronics.
The worldwide supply of packaging substrates for Silicon chips is dominated by a few large fabricators. Most of them are located in Asia and currently allocating most of their production capacity to high-volume customers in the computer, mobile phone, and automotive industries. OEMs with smaller order volumes are facing lead-times of 12 months and more. In this webinar, Dr. Stephan Trautweiler and Julia Wülser will explain how Dyconex is supplying packaging substrates for small to medium volumes and contributing to paving the way to a European supply chain for microelectronics.
