Features for Packaging Substrates (II)
Find out, how to make your IC substrates thinner, smaller, better.
Find out, how to make your IC substrates thinner, smaller, better.
Abstract
For today’s state of the art packaging solutions multifunctional requirements like high packaging density, low CTE, high signal integrity, high thermal conductivity and high reliability must be fulfilled. Within this webinar we present more state of the art PCB design features like wire bond and flip chip patterns, integrated thin film metal resistors and RF features. Interconnect stress test and traceability are also topics that will be discussed.
For today’s state of the art packaging solutions multifunctional requirements like high packaging density, low CTE, high signal integrity, high thermal conductivity and high reliability must be fulfilled. Within this webinar we present more state of the art PCB design features like wire bond and flip chip patterns, integrated thin film metal resistors and RF features. Interconnect stress test and traceability are also topics that will be discussed.
