MST presents:
Video on Demand: Features for Packaging Substrates

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Features for Packaging Substrates (I)
Find out, how to make your IC substrates thinner, smaller, better.

For today’s state of the art packaging solutions multifunctional requirements like high packaging density, low CTE, high signal integrity, high thermal conductivity and high reliability must be fulfilled.
Within this webinar we present the first two of eight different state of the art PCB design features (artwork resolution & via stacking) and how to use them in various packaging applications.

Presentation by
Daniel Schulze,
​​​​​​​Application Engineering Manager

Introduction     5 min
Presentation   20 min
Q&A Session   10 min

35 minutes