Advanced IC substrates - Challenges in manufacturing and supply chain
Abstract
The webinar focuses on the complexities faced by the semiconductor industry in manufacturing and supplying advanced integrated circuit (IC) substrates. As technology advances, the demand for high-performance, miniaturized electronic devices is increasing.
Participants will explore the technical sophistication involved in designing and manufacturing substrates with high-density interconnects, advanced packaging, and fine-line circuitry. The session will cover manufacturing processes, materials, and technologies.
The webinar will also address the complexities of the supply chain. The global nature of the industry and the interdependencies between manufacturers, suppliers, and customers present unique challenges.
The webinar focuses on the complexities faced by the semiconductor industry in manufacturing and supplying advanced integrated circuit (IC) substrates. As technology advances, the demand for high-performance, miniaturized electronic devices is increasing.
Participants will explore the technical sophistication involved in designing and manufacturing substrates with high-density interconnects, advanced packaging, and fine-line circuitry. The session will cover manufacturing processes, materials, and technologies.
The webinar will also address the complexities of the supply chain. The global nature of the industry and the interdependencies between manufacturers, suppliers, and customers present unique challenges.
