MST presents:
Video on Demand:
Advanced Flexible Substrates
Discussion and Q&A Session with Jason Doyle and Daniel Schulze

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Advanced Flexible Substrates

In this webinar, we will discuss the actual challenges in flexible PCB technology and how we can reach a higher degree of miniaturization. We will talk about how to deal with thinner flexible materials and how to push the boundaries.
We also explain why SAP (Semi Additive Technology) is becoming increasingly important and show you on the example of a flex wrap-around substrate various exciting solution for electronic needs.
Jason Doyle
Key Account Manager, DYCONEX AG

Daniel Schulze
Application Engineering Manager, DYCONEX AG

Presentation   25 min
Q&A Session   10 min

35 minutes