Advanced Flexible Substrates
Abstract
In this webinar, we will discuss the actual challenges in flexible PCB technology and how we can reach a higher degree of miniaturization. We will talk about how to deal with thinner flexible materials and how to push the boundaries.
We also explain why SAP (Semi Additive Technology) is becoming increasingly important and show you on the example of a flex wrap-around substrate various exciting solution for electronic needs.
In this webinar, we will discuss the actual challenges in flexible PCB technology and how we can reach a higher degree of miniaturization. We will talk about how to deal with thinner flexible materials and how to push the boundaries.
We also explain why SAP (Semi Additive Technology) is becoming increasingly important and show you on the example of a flex wrap-around substrate various exciting solution for electronic needs.
